EC 701 Elective – I (EC – 7011 Wireless Communication)
Molisch: Wireless Communications, Wiley India.
Taub and Schilling: Principles of Communication Systems, TMH.
Haykin: Mordern Wireless Communication, Pearson Education.
Upena Dalal: Wireless Communication, Oxford University Press.
Rappaport: Wireless Communication, Pearson Education.
Price: Wireless Communication and Networks, TMH.
Palanivelu and Nakkereeran : Wireless and Mobile Communication, PHI Learning.
Chidambara Nathan: Wireless Communication, PHI Learning.
EC 701 Elective – I (EC – 7012 Digital Image Processing)
Introduction, examples of fields that use DIP, fundamental steps in DIP, components of an image processing system.
Two-dimensional (2D) impulse and its shifting properties, 2D continuous Fourier Transform pair, 2D sampling and sampling theorem, 2D Discrete Fourier Transform (DFT), properties of 2D DFT.
Image degradation/restoration, noise models, restoration by spatial filtering, noise reduction by frequency domain filtering, linear position invariant degradations, estimation of degradation function, inverse filtering, Wiener filtering, image reconstruction from projection.
Digital image watermarking, representation and description- minimum perimeter polygons algorithm (MPP).
Gonzalez and Woods: Digital Image Processing, Pearson Education.
Anil Jain: Fundamentals of Digital Image Processing, PHI Learning.
Annadurai: Fundamentals of Digital Image Processing, Pearson Education.
Sonka, Hlavac and Boyle: Digital Image Processing and Computer Vision, Cengage Learning.
Chanda and Majumder: Digital Image Processing and Analysis, PHI Learning.
Jayaraman, Esakkirajan and Veerakumar: Digital Image Processing, TMH.
William K. Pratt, Digital Image Processing, Wiley India.
EC 701 Elective – I (EC – 7013 Neural Networks)
Introduction, benefits of neural network, models of a neuron, neural network as directed graph, network architectures, artificial intelligence and neural network.
Learning processes: error correction learning, memory based learning, Hebbian learning, competitive learning, Boltzman learning, learning tasks, adaptation, statistical nature of learning process, statistical learning theory.
Single layer perceptrons: adaptive filtering problem, unconstrained optimization technique, linear least squares filter, least mean square algorithm (LMS), perceptron convergence theorem
Multi layer perceptron: architecture, back propagation algorithm, generalization, approximations of functions, network pruning techniques.
Cover’s theorem on the separability of patterns, interpolation problem, supervised learning as an Ill-posed hyper surface reconstruction problem, regularization theory, regularization network, generalized radial basis function networks (RBF), estimation of the regularization parameter, approximation properties of RBF networks, comparison of RBF networks and multilayer perceptrons, Kernel regression and its relation to RBF networks, learning strategies.
Entropy, maximum entropy principle, mutual information, Kullback-Leibler divergence, mutual information as an objective function to be optimized, maximum mutual information principle, infomax and redundancy reduction, spatially coherent and incoherent features, independent components analysis, maximum likelihood estimation, maximum entropy method.
introduction, recurrent network architectures, state space model, non-linear autogressive with exogenous inputs model, computational power of recurrent networks, learning algorithms, back propagation through time, real time recurrent learning, Kalman filter, decoupled Kalman filter, vanishing gradients in recurrent networks, system identification, model reference adaptive control.
Haykin: Neural Networks- A Comprehensive Foundation, PHI Learning.
Sivanandam, Sumathi and Deepa: Introduction to Neural Networks using Matlab, TMH.
Freeman and Skapura: Fundamentals of Neural Networks- algorithms, applications and programming techniques, Pearson Education.
Hagan, Demuth and Beale: Neural Network Design, Cengage Learning.
Anderson: An introduction ro Neural Networks, PHI Learning.
Satish Kumar: Neural Networks, TMH.
EC-702 Satellite Communication
Interference between satellite circuits.
Roddy: Satellite Communications, TMH.
Timothy Prattt: Satellite Communications, Wiley India.
Pritchard, Suyderhoud and Nelson: Satellite Communication Systems Engineering, Pearson Education.
Agarwal: Satellite Communications, Khanna Publishers.
Gangliardi: Satellite Communications, CBS Publishers.
Chartrand: Satellite Communication, Cengage Learning.
Raja Rao: Fundamentals of Satellite communications, PHI Learning.
Monojit Mitra: Satellite Communication: PHI Learning.
EC-703 Optical Communication
circular waveguides, single mode fibers, graded-index fiber structure, fiber materials, photonic crystal fibers, fiber fabrication, fiber optic cables.
Keiser: Optical Fiber Communications, TMH.
Senior: Optical Fiber Communication- Principles and Practices, Pearson Education.
Agarwal: Fiber Optic Communication Systems, Wiley India.
Palais: Fiber Optics Communications, Pearson Education.
Satish Kumar: Fundamentals of optical Communications, PHI Learning.
Khare: Fiber Optics and Optoelectronics, Oxford University Press.
Ghatak and Thyagrajan: Fiber Optics and Lasers, Macmillan India Ltd.
Gupta: Optoelectronic Devices and Systems, PHI Learning.
Sterling: Introduction to Fiber Optics, Cengage Learning.
Launching of light into the optical fiber and calculate the numerical aperture and V-number.
Observing Holograms and their study.
Measurement of attenuation loss in an optical fiber.
Diffraction using gratings.
Construction of Michelson interferometer.
Setting up a fiber optic analog link and study of PAM.
Setting up a fiber optic digital link and study of TDM and Manchester coding.
Measurement of various misalignment losses in an optical fiber.
EC-704 Microwave Engineering
General representation of EM field in terms of TEM, TE and TM components, Uniform guide structures, rectangular wave guides, Circular Wave guides, Solution in terms of various modes, Properties of propagating and evanescent modes, Dominant modes, Normalized model voltages and currents, Power flow and energy storage in modes frequency range of operation for single mode working, effect of higher order modes, Strip line and micro strip lines general properties, Comparison of coaxial, Micro strip and rectangular wave guides in terms of band width, power handling capacity, economical consideration etc.
Transmission line ports of microwave network, Scattering matrix, Properties of scattering matrix of reciprocal, Non reciprocal, loss less, Passive networks, Examples of two, three and four port networks, wave guide components like attenuator, Phase shifters and couplers, Flanges, Bends, Irises, Posts, Loads, Principle of operation and properties of E-plane, H-plane Tee junctions of wave guides, Hybrid T, Multi-hole directional coupler, Directional couplers, Microwave resonators- rectangular. Excitation of wave guide and resonators by couplers. Principles of operation of non reciprocal devices, properties of ferrites, Isolators and phase shifters.
PIN diodes, Properties and applications, Microwave detector diodes, detection characteristics, Varactor diodes, parametric amplifier fundamentals, Manley-Rowe power relation MASER, LASER , Amplifiers, Frequency converters and harmonic generators using varactor diodes, Transferred electron devices, Gunn effect, Various modes of operation of Gunn oscillator, IMPATT, TRAPATT and BARITT.
Interaction of electron beam with electromagnetic field, power transfer condition. Principles of working of two cavity and Reflex Klystrons, arrival time curve and oscillation conditions in reflex klystrons, mode- frequency characteristics. Effect of repeller voltage variation on power and frequency of output. Principle of working of magnetrons. Electron dynamics in planar and cylindrical magnetrons, Cutoff magnetic field, Resonant cavities in magnetron, Π-mode operation Mode separation techniques, Rising sun cavity and strapping. Principle of working of TWT amplifier. Slow wave structures, Approximate gain relationship in forward wave TWT.
Square law detection, Broadband and tuned detectors. Wave-guide probes, Probe and detector mounts,
Slotted line
arrangement and VSWR meter, Measurement of wave-guide impedance at load port by slotted line, Microwave bench components and source modulation. Measurement of scattering matrix parameters, High, Medium and low-level power measurement techniques, Characteristics of bolometers, bolometer mounts, Power measurement bridges, Microwave frequency measurement techniques, calibrated resonators (transmission and absorption type). Network Analyzer and its use in measurements.
Liao: Microwave Devices and Circuits, Pearson Education.
Das: Microwave Engineering, TMH.
Rao: Microwave Engineering, PHI Learning.
Collins: Foundations of Microwave Engineering, Wiley India.
Srivastava and Gupta: Microwave Devices and Circuits, PHI Learning.
Reich: Microwave Principles, East West Press.
Pozar: Microwave Engineering, Wiley India.
Roy and Mitra: Microwave Semiconductor Devices, PHI learning.
Study the characteristics of Klystron Tube and to determine its electronic tuning range.
To determine the frequency and wavelength in a rectangular wave-guide working on TE10 mode.
To determine the Standing Wave-Ratio and reflection coefficient.
To measure an unknown impedance with Smith Chart.
To study the V-I characteristics of Gunn Diode.
To study the following characteristics of Gunn Diode.
Output power and frequency as a function of voltage.
Square wave modulation through PIN diode.
Study the function of Magic Tee by measuring the following parameters.
Measurement of VSWR at different ports and
Measurement of isolation and coupling coefficient.
Study the function of Isolator / Circulator by measuring the following parameters.
Input VSWR measurement of Isolator / Circulator.
Measurement of insertion loss and isolation.
Study the function of Attenuator (Fixed and Variable type) by measuring the following parameters.
Input VSWR measurement.
Measurement of insertion loss and attenuation.
Study the function of Multi Hole Directional Coupler by measuring the following parameters.
To measure main line and auxiliary line VSWR.
To measure the coupling factor and directivity.
Study of a network analyzer and measurements using it.
EC-705 VLSI Design
Introduction, Size and complexity of Integrated Circuits, The Microelectronics Field, IC Production Process, Processing Steps, Packaging and Testing, MOS Processes, NMOS Process, CMOS Process, Bipolar Technology, Hybrid Technology, Design Rules and Process Parameters.
Dc Models, Small Signal Models, MOS Models, MOSFET Models in High Frequency and small signal, Short channel devices, Sub threshold Operations, Modeling Noise Sources in MOSFET’s, Diode Models, Bipolar Models, Passive component Models.
Introduction, Circuit Simulation Using Spice, MOSFET Model, Level 1 Large signal model, Level 2 Large Signal Model, High Frequency Model, Noise Model of MOSFET, Large signal Diode Current, High Frequency BJT Model, BJT Noise Model, Temperature Dependence of BJT.
Random Logic and Structured Logic Forms, Register Storage Circuits, Quasi Static Register Cells, A Static Register Cell, Micro coded Controllers, Microprocessor Design, Systolic Arrays, Bit-Serial Processing Elements, Algotronix.
Basic CMOS Technology, A Basic n-well CMOS Process, Twin Tub Processes, CMOS Process Enhancement, Interconnects and Circuit Elements, Layout Design Rules, Latch up, Physical Origin, Latch up Triggering, Latch up Prevention, Internal Latch up Prevention Techniques.
Geiger, Allen and Strader: VLSI Design Techniques for Analog and Digital Circuits, TMH.
Sorab Gandhi: VLSI Fabrication Principles, Wiley India.
Weste and Eshraghian: Principles of CMOS VLSI design, Addison-Wesley
Weste, Harris and Banerjee: CMOS VLSI Design, Pearson-Education.
Pucknell and Eshraghian: Basic VLSI Design, PHI Learning.
Sze: VLSI Technology, TMH.
EC-706 Minor Project and Seminar
The student should select a topic (from the subjects he has studied so far or any topic related to real life problem). He should do the literature survey, analyze the problem and propose some solution for the same. He should prepare a detailed (typed) report regarding the topic and should present the same with the help of power point presentation at the end of the semester. The analysis of the problem may be done with the help of some software or any hardware (which may be made by the student).
EC-707 Industrial Training
Duration: 4 weeks after the VI semester in the summer break. Assessment in VII semester.
For the assessment of industrial training undertaken by the students, following components are considered with respective weightage.
Attendance and General Discipline 05
Daily diary Maintenance 05
Initiative and Participative attitude during training 05
Assessment of training by Industrial Supervisor/s 15
Training Report 20
Seminar and cross questioning (defense) 30
Marks of various components in industry should be awarded to the student, in consultation with the Training and Placement Officer (TPO)/ Faculty of the institute, who must establish contact with the supervisor/ authorities of the organization where, students have taken training, to award the marks for term work. During training, students will prepare a first draft of the training report in consultation with the section incharge. After training they will prepare final draft with the help of the TPO/ faculty of the institute. Then, they will present a seminar on their training and will face viva-voce on training in the institute.
=======EC 701 Elective – I (EC – 7011 Wireless Communication)
Molisch: Wireless Communications, Wiley India.
Taub and Schilling: Principles of Communication Systems, TMH.
Haykin: Mordern Wireless Communication, Pearson Education.
Upena Dalal: Wireless Communication, Oxford University Press.
Rappaport: Wireless Communication, Pearson Education.
Price: Wireless Communication and Networks, TMH.
Palanivelu and Nakkereeran : Wireless and Mobile Communication, PHI Learning.
Chidambara Nathan: Wireless Communication, PHI Learning.
EC 701 Elective – I (EC – 7012 Digital Image Processing)
Introduction, examples of fields that use DIP, fundamental steps in DIP, components of an image processing system.
Two-dimensional (2D) impulse and its shifting properties, 2D continuous Fourier Transform pair, 2D sampling and sampling theorem, 2D Discrete Fourier Transform (DFT), properties of 2D DFT.
Image degradation/restoration, noise models, restoration by spatial filtering, noise reduction by frequency domain filtering, linear position invariant degradations, estimation of degradation function, inverse filtering, Wiener filtering, image reconstruction from projection.
Digital image watermarking, representation and description- minimum perimeter polygons algorithm (MPP).
Gonzalez and Woods: Digital Image Processing, Pearson Education.
Anil Jain: Fundamentals of Digital Image Processing, PHI Learning.
Annadurai: Fundamentals of Digital Image Processing, Pearson Education.
Sonka, Hlavac and Boyle: Digital Image Processing and Computer Vision, Cengage Learning.
Chanda and Majumder: Digital Image Processing and Analysis, PHI Learning.
Jayaraman, Esakkirajan and Veerakumar: Digital Image Processing, TMH.
William K. Pratt, Digital Image Processing, Wiley India.
EC 701 Elective – I (EC – 7013 Neural Networks)
Introduction, benefits of neural network, models of a neuron, neural network as directed graph, network architectures, artificial intelligence and neural network.
Learning processes: error correction learning, memory based learning, Hebbian learning, competitive learning, Boltzman learning, learning tasks, adaptation, statistical nature of learning process, statistical learning theory.
Single layer perceptrons: adaptive filtering problem, unconstrained optimization technique, linear least squares filter, least mean square algorithm (LMS), perceptron convergence theorem
Multi layer perceptron: architecture, back propagation algorithm, generalization, approximations of functions, network pruning techniques.
Cover’s theorem on the separability of patterns, interpolation problem, supervised learning as an Ill-posed hyper surface reconstruction problem, regularization theory, regularization network, generalized radial basis function networks (RBF), estimation of the regularization parameter, approximation properties of RBF networks, comparison of RBF networks and multilayer perceptrons, Kernel regression and its relation to RBF networks, learning strategies.
Entropy, maximum entropy principle, mutual information, Kullback-Leibler divergence, mutual information as an objective function to be optimized, maximum mutual information principle, infomax and redundancy reduction, spatially coherent and incoherent features, independent components analysis, maximum likelihood estimation, maximum entropy method.
introduction, recurrent network architectures, state space model, non-linear autogressive with exogenous inputs model, computational power of recurrent networks, learning algorithms, back propagation through time, real time recurrent learning, Kalman filter, decoupled Kalman filter, vanishing gradients in recurrent networks, system identification, model reference adaptive control.
Haykin: Neural Networks- A Comprehensive Foundation, PHI Learning.
Sivanandam, Sumathi and Deepa: Introduction to Neural Networks using Matlab, TMH.
Freeman and Skapura: Fundamentals of Neural Networks- algorithms, applications and programming techniques, Pearson Education.
Hagan, Demuth and Beale: Neural Network Design, Cengage Learning.
Anderson: An introduction ro Neural Networks, PHI Learning.
Satish Kumar: Neural Networks, TMH.
EC-702 Satellite Communication
Interference between satellite circuits.
Roddy: Satellite Communications, TMH.
Timothy Prattt: Satellite Communications, Wiley India.
Pritchard, Suyderhoud and Nelson: Satellite Communication Systems Engineering, Pearson Education.
Agarwal: Satellite Communications, Khanna Publishers.
Gangliardi: Satellite Communications, CBS Publishers.
Chartrand: Satellite Communication, Cengage Learning.
Raja Rao: Fundamentals of Satellite communications, PHI Learning.
Monojit Mitra: Satellite Communication: PHI Learning.
EC-703 Optical Communication
circular waveguides, single mode fibers, graded-index fiber structure, fiber materials, photonic crystal fibers, fiber fabrication, fiber optic cables.
Keiser: Optical Fiber Communications, TMH.
Senior: Optical Fiber Communication- Principles and Practices, Pearson Education.
Agarwal: Fiber Optic Communication Systems, Wiley India.
Palais: Fiber Optics Communications, Pearson Education.
Satish Kumar: Fundamentals of optical Communications, PHI Learning.
Khare: Fiber Optics and Optoelectronics, Oxford University Press.
Ghatak and Thyagrajan: Fiber Optics and Lasers, Macmillan India Ltd.
Gupta: Optoelectronic Devices and Systems, PHI Learning.
Sterling: Introduction to Fiber Optics, Cengage Learning.
Launching of light into the optical fiber and calculate the numerical aperture and V-number.
Observing Holograms and their study.
Measurement of attenuation loss in an optical fiber.
Diffraction using gratings.
Construction of Michelson interferometer.
Setting up a fiber optic analog link and study of PAM.
Setting up a fiber optic digital link and study of TDM and Manchester coding.
Measurement of various misalignment losses in an optical fiber.
EC-704 Microwave Engineering
General representation of EM field in terms of TEM, TE and TM components, Uniform guide structures, rectangular wave guides, Circular Wave guides, Solution in terms of various modes, Properties of propagating and evanescent modes, Dominant modes, Normalized model voltages and currents, Power flow and energy storage in modes frequency range of operation for single mode working, effect of higher order modes, Strip line and micro strip lines general properties, Comparison of coaxial, Micro strip and rectangular wave guides in terms of band width, power handling capacity, economical consideration etc.
Transmission line ports of microwave network, Scattering matrix, Properties of scattering matrix of reciprocal, Non reciprocal, loss less, Passive networks, Examples of two, three and four port networks, wave guide components like attenuator, Phase shifters and couplers, Flanges, Bends, Irises, Posts, Loads, Principle of operation and properties of E-plane, H-plane Tee junctions of wave guides, Hybrid T, Multi-hole directional coupler, Directional couplers, Microwave resonators- rectangular. Excitation of wave guide and resonators by couplers. Principles of operation of non reciprocal devices, properties of ferrites, Isolators and phase shifters.
PIN diodes, Properties and applications, Microwave detector diodes, detection characteristics, Varactor diodes, parametric amplifier fundamentals, Manley-Rowe power relation MASER, LASER , Amplifiers, Frequency converters and harmonic generators using varactor diodes, Transferred electron devices, Gunn effect, Various modes of operation of Gunn oscillator, IMPATT, TRAPATT and BARITT.
Interaction of electron beam with electromagnetic field, power transfer condition. Principles of working of two cavity and Reflex Klystrons, arrival time curve and oscillation conditions in reflex klystrons, mode- frequency characteristics. Effect of repeller voltage variation on power and frequency of output. Principle of working of magnetrons. Electron dynamics in planar and cylindrical magnetrons, Cutoff magnetic field, Resonant cavities in magnetron, Π-mode operation Mode separation techniques, Rising sun cavity and strapping. Principle of working of TWT amplifier. Slow wave structures, Approximate gain relationship in forward wave TWT.
Square law detection, Broadband and tuned detectors. Wave-guide probes, Probe and detector mounts,
Slotted line
arrangement and VSWR meter, Measurement of wave-guide impedance at load port by slotted line, Microwave bench components and source modulation. Measurement of scattering matrix parameters, High, Medium and low-level power measurement techniques, Characteristics of bolometers, bolometer mounts, Power measurement bridges, Microwave frequency measurement techniques, calibrated resonators (transmission and absorption type). Network Analyzer and its use in measurements.
Liao: Microwave Devices and Circuits, Pearson Education.
Das: Microwave Engineering, TMH.
Rao: Microwave Engineering, PHI Learning.
Collins: Foundations of Microwave Engineering, Wiley India.
Srivastava and Gupta: Microwave Devices and Circuits, PHI Learning.
Reich: Microwave Principles, East West Press.
Pozar: Microwave Engineering, Wiley India.
Roy and Mitra: Microwave Semiconductor Devices, PHI learning.
Study the characteristics of Klystron Tube and to determine its electronic tuning range.
To determine the frequency and wavelength in a rectangular wave-guide working on TE10 mode.
To determine the Standing Wave-Ratio and reflection coefficient.
To measure an unknown impedance with Smith Chart.
To study the V-I characteristics of Gunn Diode.
To study the following characteristics of Gunn Diode.
Output power and frequency as a function of voltage.
Square wave modulation through PIN diode.
Study the function of Magic Tee by measuring the following parameters.
Measurement of VSWR at different ports and
Measurement of isolation and coupling coefficient.
Study the function of Isolator / Circulator by measuring the following parameters.
Input VSWR measurement of Isolator / Circulator.
Measurement of insertion loss and isolation.
Study the function of Attenuator (Fixed and Variable type) by measuring the following parameters.
Input VSWR measurement.
Measurement of insertion loss and attenuation.
Study the function of Multi Hole Directional Coupler by measuring the following parameters.
To measure main line and auxiliary line VSWR.
To measure the coupling factor and directivity.
Study of a network analyzer and measurements using it.
EC-705 VLSI Design
Introduction, Size and complexity of Integrated Circuits, The Microelectronics Field, IC Production Process, Processing Steps, Packaging and Testing, MOS Processes, NMOS Process, CMOS Process, Bipolar Technology, Hybrid Technology, Design Rules and Process Parameters.
Dc Models, Small Signal Models, MOS Models, MOSFET Models in High Frequency and small signal, Short channel devices, Sub threshold Operations, Modeling Noise Sources in MOSFET’s, Diode Models, Bipolar Models, Passive component Models.
Introduction, Circuit Simulation Using Spice, MOSFET Model, Level 1 Large signal model, Level 2 Large Signal Model, High Frequency Model, Noise Model of MOSFET, Large signal Diode Current, High Frequency BJT Model, BJT Noise Model, Temperature Dependence of BJT.
Random Logic and Structured Logic Forms, Register Storage Circuits, Quasi Static Register Cells, A Static Register Cell, Micro coded Controllers, Microprocessor Design, Systolic Arrays, Bit-Serial Processing Elements, Algotronix.
Basic CMOS Technology, A Basic n-well CMOS Process, Twin Tub Processes, CMOS Process Enhancement, Interconnects and Circuit Elements, Layout Design Rules, Latch up, Physical Origin, Latch up Triggering, Latch up Prevention, Internal Latch up Prevention Techniques.
Geiger, Allen and Strader: VLSI Design Techniques for Analog and Digital Circuits, TMH.
Sorab Gandhi: VLSI Fabrication Principles, Wiley India.
Weste and Eshraghian: Principles of CMOS VLSI design, Addison-Wesley
Weste, Harris and Banerjee: CMOS VLSI Design, Pearson-Education.
Pucknell and Eshraghian: Basic VLSI Design, PHI Learning.
Sze: VLSI Technology, TMH.
EC-706 Minor Project and Seminar
The student should select a topic (from the subjects he has studied so far or any topic related to real life problem). He should do the literature survey, analyze the problem and propose some solution for the same. He should prepare a detailed (typed) report regarding the topic and should present the same with the help of power point presentation at the end of the semester. The analysis of the problem may be done with the help of some software or any hardware (which may be made by the student).
EC-707 Industrial Training
Duration: 4 weeks after the VI semester in the summer break. Assessment in VII semester.
For the assessment of industrial training undertaken by the students, following components are considered with respective weightage.
Attendance and General Discipline 05
Daily diary Maintenance 05
Initiative and Participative attitude during training 05
Assessment of training by Industrial Supervisor/s 15
Training Report 20
Seminar and cross questioning (defense) 30
Marks of various components in industry should be awarded to the student, in consultation with the Training and Placement Officer (TPO)/ Faculty of the institute, who must establish contact with the supervisor/ authorities of the organization where, students have taken training, to award the marks for term work. During training, students will prepare a first draft of the training report in consultation with the section incharge. After training they will prepare final draft with the help of the TPO/ faculty of the institute. Then, they will present a seminar on their training and will face viva-voce on training in the institute.
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